Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations | |
Yang XS; Wang YJ(王云江)![]() ![]() | |
Source Publication | JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
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2016 | |
Volume | 94Pages:191-206 |
ISSN | 0022-5096 |
Abstract | In the present work, we performed experiments, atomistic simulations, and high-resolution electron microscopy (HREM) to study the creep behaviors of the nanotwinned (nt) and nanograined (ng) copper at temperatures of 22 degrees C (RT), 40 degrees C, 50 degrees C, 60 degrees C, and 70 degrees C. The experimental data at various temperatures and different sustained stress levels provide sufficient information, which allows one to extract the deformation parameters reliably. The determined activation parameters and microscopic observations indicate transition of creep mechanisms with variation in stress level in the nt-Cu, i.e., from the Coble creep to the twin boundary (TB) migration and eventually to the perfect dislocation nucleation and activities. The experimental and simulation results imply that nanotwinfling could be an effective approach to enhance the creep resistance of twin-free ng-Cu. The experimental creep results further verify the newly developed formula (Yang et al., 2016) that describes the time-, stress-, and temperature-dependent plastic deformation in polycrystalline copper. (C) 2016 Elsevier Ltd. All rights reserved. |
Keyword | Creep Nanotwin Activation Parameters Hrtem Atomistic Simulations |
DOI | 10.1016/j.jmps.2016.04.021 |
URL | 查看原文 |
Indexed By | SCI ; EI |
Language | 英语 |
WOS ID | WOS:000382342300012 |
WOS Keyword | Creep ; Nanotwin ; Activation parameters ; HRTEM ; Atomistic simulations |
WOS Research Area | Materials Science ; Mechanics ; Physics |
WOS Subject | Materials Science, Multidisciplinary ; Mechanics ; Physics, Condensed Matter |
Funding Organization | This work was supported by the General Research Fund (No. 622911) from the Hong Kong Research Grants Council and the National Basic Research Program of China (No. 2012CB937502). T.Y.Z. is grateful for the financial support by the Research Grant (No.14DZ2261200) from the Science and Technology Commission of Shanghai Municipality. Y.J.W and L.H.D acknowledge the financial supports from the NSFC (Nos. 11132011, 11402269, 11472287), the National Key Basic Research Program of China (No. 2012CB937500), and the CAS/SAFEA International Partnership Program for Creative Research Teams. G.Y. W thanks the National Natural Science Foundation (No. 51401083). |
Department | LNM冲击动力学与新型材料力学性能 |
Classification | 一类 |
Ranking | 2 |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://dspace.imech.ac.cn/handle/311007/59744 |
Collection | 非线性力学国家重点实验室 |
Corresponding Author | Zhang, TY (reprint author), Shanghai Univ, Shanghai Univ Mat Genome Inst, 99 Shangda Rd, Shanghai 200444, Peoples R China. |
Recommended Citation GB/T 7714 | Yang XS,Wang YJ,Zhai HR,et al. Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations[J]. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,2016,94:191-206. |
APA | Yang XS.,Wang YJ.,Zhai HR.,Wang GY.,Su YJ.,...&Zhang, TY .(2016).Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations.JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS,94,191-206. |
MLA | Yang XS,et al."Time-, stress-, and temperature-dependent deformation in nanostructured copper: Creep tests and simulations".JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS 94(2016):191-206. |
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