Knowledge Management System of Institue of Mechanics, CAS
| Thermal-mechanical interface crack behaviour of a surface mount solder joint | |
Wu CML; Lai JKL; Wu YL(吴永礼) ; Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China.
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| Source Publication | Finite Elements in Analysis and Design
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| 1998 | |
| Volume | 30Issue:1-2Pages:19-30 |
| ISSN | 0168-874X |
| Abstract | The effect of thermal-mechanical loading on a surface mount assembly with interface cracks between the solder and the resistor and between the solder and the printed circuit board (PCB) was studied using a non-linear thermal finite element analysis. The thermal effect was taken as cooling from the solder eutectic temperature to room temperature. Mechanical loading at the ends of the PCB was also applied. The results showed that cooling had the effect of causing large residual shear displacement at the region near the interface cracks. The mechanical loading caused additional crack opening displacements. The analysis on the values of J-integral for the interface cracks showed that J-integral was approximately path independent, and that the effect of crack at the solder/PCB interface is much more serious than that between the component and solder. |
| Subject Area | 力学 |
| DOI | 10.1016/S0168-874X(98)00028-6 |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:000075181400003 |
| WOS Keyword | BONDED JOINTS |
| WOS Research Area | Mathematics ; Mechanics |
| WOS Subject | Mathematics, Applied ; Mechanics |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/16074 |
| Collection | 力学所知识产出(1956-2008) |
| Corresponding Author | Wu, CML (reprint author), City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China. |
| Recommended Citation GB/T 7714 | Wu CML,Lai JKL,Wu YL,et al. Thermal-mechanical interface crack behaviour of a surface mount solder joint[J]. Finite Elements in Analysis and Design,1998,30,1-2,:19-30. |
| APA | Wu CML,Lai JKL,吴永礼,&Wu, CML .(1998).Thermal-mechanical interface crack behaviour of a surface mount solder joint.Finite Elements in Analysis and Design,30(1-2),19-30. |
| MLA | Wu CML,et al."Thermal-mechanical interface crack behaviour of a surface mount solder joint".Finite Elements in Analysis and Design 30.1-2(1998):19-30. |
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