Knowledge Management System of Institue of Mechanics, CAS
| Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer | |
Zhou Y; Yang CS; Chen JA; Ding GF,; Ding W; Wang L; Wang MJ; Zhang YM ; 张泰华
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| Source Publication | Thin Solid Films
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| 2004 | |
| Volume | 460Issue:1Pages:175-180 |
| ISSN | 0040-6090 |
| Subject Area | 力学 |
| DOI | 10.1016/j.tsf.2004.01.088 |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:000222217500025 |
| WOS Research Area | Materials Science ; Physics |
| WOS Subject | Materials Science, Multidisciplinary ; Materials Science, Coatings & Films ; Physics, Applied ; Physics, Condensed Matter |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://dspace.imech.ac.cn/handle/311007/15573 |
| Collection | 力学所知识产出(1956-2008) |
| Recommended Citation GB/T 7714 | Zhou Y,Yang CS,Chen JA,等. Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer[J]. Thin Solid Films,2004,460,1,:175-180. |
| APA | Zhou Y.,Yang CS.,Chen JA.,Ding GF,.,Ding W.,...&张泰华.(2004).Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer.Thin Solid Films,460(1),175-180. |
| MLA | Zhou Y,et al."Measurement of Young’s modulus and residual stress of copper filmelectroplated on silicon wafer".Thin Solid Films 460.1(2004):175-180. |
| Files in This Item: | Download All | |||||
| File Name/Size | DocType | Version | Access | License | ||
| Measurement of Young（269KB） | 开放获取 | -- | View Download | |||
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